| 摘要 |
PURPOSE:To secure simultaneously high density mounting and heat dissipation at a semiconductor device by a method wherein pellets of the plural number are mounted on an insulating substrate of favorable heat conductivity, and the mounted substrates thereof of the plural number are mounted on an insulating substrate of favorable heat conductivity to construct a tier construction. CONSTITUTION:A semiconductor device is provided with a mother board 1 as a wiring substrate, and subboards 2 of the plural number as pellet mounting substrates. The boards 1, 2 thereof are constructed by using an electrically insulating substrate consisting of a material mainly consisting of silicon carbide as an electrically insulating material of favorable heat conductivity. Pellets 5 of the plural number are connected mechanically and moreover electrically to be mounted according to the face down bonding method to the top of the subboards 2. The respective pellets 5 are so constructed as to have circuits enabled to display a memory function and a logic function, etc., and so designed properly as to be enabled to display the desired integrated function according to the pellets 5 of the plural number. Pads 7 of a large number of pieces for repair of the logic function are formed in the neighborhoods of the respective pellets 5 on the tops of the subboards 2, and the pads 7 thereof are used as occasion demands for the change of the circuit when the desired logic function can not be obtained. |
