Adhesives and devices coated therewith

摘要

Novel curable adhesives are solid, substantially free of cross-linking and substantially tack-free at 25 DEG C.; remain substantially uncured when maintained for extended periods at 80 DEG C.; have an initial viscosity of 103 to 104 poise at 150 DEG C. and cure relatively slowly at 150 DEG C.; and cure rapidly at 200 DEG C. The adhesives preferably contain at least one epoxy resin, particularly an epoxy resin having a softening point of at least 50 DEG C. and an epoxy equivalent weight of at least 200 in combination with an epoxy resin which is liquid at 25 DEG C. or an elastomer or other compatible high molecular weight polymer. The adhesive preferably also contains a high temperature curing agent and preferably also a filler, which may be particulate or fibrous. The novel adhesives are particularly useful in combination with heat-recoverable devices, e.g. devices comprising components made of heat-recoverable metal.