A wafer handling method and apparatus insures proper centering of a wafer at a work station and controls the heat transferred to the wafer in a baking operation. The amount of heat transferred and the rate at which the heat is transferred to the wafer are regulated by controlling the distance between the wafer and a hot plate. The hot plate is maintained at a constant temperature higher than the bake out or equilibrium temperature to which the wafer is to be heated.
申请公布号
US4507078(A)
申请公布日期
1985.03.26
申请号
US19830479197
申请日期
1983.03.28
申请人
SILICON VALLEY GROUP, INC.
发明人
TAM, JOHANN;ASHJAEE, JALAL;KUWAKI, NOBUO B.;NGO, TUAN M.;KUNG, SUSAN W.