发明名称 WAFER PROCESSING APPARATUS
摘要 PURPOSE:To smoothly transport the wafers having different sizes in mixed state by detecting the size of a wafer in the upstream part of a wafer transportation part and automatically varying the width of the guides on the both sides of the wafer transportation part on the basis of the result of the detection. CONSTITUTION:When a wafer 17 in a magazine 16 whose height can be adjusted by an elevator 14 is pushed onto a table 10 by a pusher 15, a stopper 12 is lowered at the same time. Then, the wafer 17 is attached onto the stopper 12 and positioned in the centered state. In this state, a suction hole 13b at the position opposed to the edge of the wafer 17 is detected by a vacuum sensor 13, and when the diameter D of the wafer 17 is obtained, a servomotor 7 is properly driven by the output, and a screw shaft 6 is revolved by a prescribed amount. Therefore, the width between the movable guides 4 and 4 on the both sides is adjusted through female screw members 8a and 8b. Then, the wafer 17 is transported onto an air conveyor 2 after the stopper 12 is raised.
申请公布号 JPS6052437(A) 申请公布日期 1985.03.25
申请号 JP19830160327 申请日期 1983.09.02
申请人 HITACHI SEISAKUSHO KK 发明人 NAGATOMO HIROTO;MAEJIMA HIROSHI;TAKAGAKI TETSUYA
分类号 B65H1/28;B65G1/07;B65H1/00;B65H3/24;B65H5/38;B65H9/00;B65H9/04;H01L21/00;H01L21/67;H01L21/677;H01L21/68 主分类号 B65H1/28
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