| 摘要 |
PURPOSE:To increase the capacity of power source and the speed of operations as well as enhance the operability of assembling by a method in which heating section and IC section are provided on a common supporter, and common electrode wiring for the IC section is provided on the back side and/or surface side of a film carrier tape. CONSTITUTION:A heating section 2 and IC chips 4 are provided together on a base plate 1 as a common supporter. A printed substrate 5 on which the IC chips 4 are mounted is set separately with a spacing in the face of a resistor plate 3 on the heating section 2 side. Each wiring 12 on the printed substrate 5 and the signal electrode wiring 10 on the heating section 2 side are connected electrically and mechanically by the lead 15 of a film carrier tape 7. In this case, one tape 7 is used for plural IC chips 4. A common electrode wiring 17 for each IC chip 4 is formed on the substrate 5 at the same time as the wiring 18 is formed on the back of the occupying region of the film carrier tape 7. Since insulating separation from the wiring 15 is permitted by the tape 7, a power source line having good reliability can be formed without the needs to increase the number of processes. |
