发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PURPOSE:To lower the molding temperature of a polyamide resin without detriment to its properties, to prevent a filler, etc. from being decomposed, and to reduce the electric power consumption during molding, by mixing the polyamide resin with a small amount of novolak phenolic resin. CONSTITUTION:97-70wt% polyamide resin such as nylon 6 or nylon 66 is melt- blended with 3-30wt% novolak phenolic resin obtained by condensing a phenolic compound (e.g., phenol or p-tert-butylphenol) with formaldehyde in the presence of an acidic catalyst. If desired, the mixture is further mixed with an organic or inorganic filler, a colorant, additives, etc., to obtain the purpose polyamide resin composition. This resin composition has a molding temperature lower than that of the polyamide resin by 50 deg.C, so that the addition of a colorant, additives, etc., which are unstable to heat, becomes possible.
申请公布号 JPS6051744(A) 申请公布日期 1985.03.23
申请号 JP19830159898 申请日期 1983.08.31
申请人 DAIWA:KK 发明人 TAKAGI KANEYUKI
分类号 C08L61/10;C08L77/00 主分类号 C08L61/10
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