| 摘要 |
PURPOSE:To bond firmly silicon crystalline bodies with each other without using a bonding agent by polishing each bonding surface of the silicon crystalline bodies, making respective surfaces hydrophilic, and adhering closely under clean environment. CONSTITUTION:Each bonding surface of two silicon crystalline bodies is specularly ground respectively, and each ground surface is immersed, for example, in a mixed liquid of sulfuric acid and hydrogen peroxide to make the surface hydrophilic. Both surfaces are closely adhered to each other in a clean room, etc. wherein foreign matter is substantially excluded. The bonded part is further heated at >= about 300 deg.C to enhance the bonding strength. The method can be applied to the manufacture of a semiconductor pressure transducer, etc.
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