| 摘要 |
PURPOSE:To improve the heat sink efficiency of a heat sink unit by placing the unit for forming a vent passage on an electronic circuit in contact with a substrate of heat conductive material placed on the circuit, and providing a heat pipe and fins connected to the pipe in the unit. CONSTITUTION:An IC3 is placed on a ceramic substrate 1, and an aluminum heat sink unit which is composed of a heat pipe 6 and fins 5 connected to the pipe is mounted via screws 8 on the substrate 1 in a heat absorber 4 of the heat sink unit formed with a vent passage 7 through air. The generated heat conducted to the substrate 1 is absorbed by the absorber 4, and part of the dissipated heat is absorbed into the absorber 4 by the convection and radiation of the passage 7. The heat absorbed to the absorber 4 is dissipated externally via the fins 5 connected to the pipe 6. According to this construction, the heat sink of the IC is facilitated, and ICS can be mounted in great density. |
