| 摘要 |
PURPOSE:To prevent extra electrode material from remaining on the surface of a semiconductor substrate by a method wherein wafer carrier grooves are formed by enlarging the width in accordance with the surface side of a semiconductor substrate, and a wafer carrier body is fixed by inclination. CONSTITUTION:Many semiconductor substrates 12 with resist film patterns formed are encased in the wafer carrier 21 in aligned manner, which is then dipped in an etchant 16 by means of a carrier jig 24. In this case, the formation of one side surface of the carrier groove 22 facing to the surface side 12a of the substrate 12 into a tapered surface causes nothing to contact the surface of the substrate 12, and then enables the Al electrode material other than that at the wiring pattern to be evenly removed over the entire surface. Besides, placing the carrier body 21 by inclination to the jig 24 and by means of a drainboard 25 enables air bubbles generating from the Al surface of the substrate 12 to rise toward the back side of each substrate 12 not along the grooves 22. Thereby, the liquid 16 comes to sufficiently infiltrate in any part of the surface of the substrate 12. |
