Vacuum and/or electrostatic pinchuck for holding semiconductor wafers or other flat electrical components and method for making the same.

摘要

A method of forming a pinchuck is described using lithographic techniques to define and to etch a pattern of pins from an extremely flat surface. A block of suitable material is polished to form such an extremely flat surface. The desired pin pattern (preferably along with a vacuum sealing ring surrounding the pins) is defined with a mask, which is then used to etch the flat surface so as to form an array of pins (and optional sealing ring). Since the pins (and the optional vacuum sealing ring) are formed from a surface which is already flat, it is not necessary to polish the pins after they are formed. The top surfaces of the pins (and the top surface of the optional vacuum sealing ring) already lie within a common plane. Since lithographic techniques are used, the pin head dimensions, the number of pins, the arrangement of pins, and the density of pins all may be freely chosen without affecting the fabrication cost.
The drawings shows the completed pinchuck in use as a vacuum pinchuck supporting a silicon wafer 36. The pinchuck comprises a block of silicon having two holes 14, 15 in it through which vacuum suction and an electrical connection 38 can be made to a wafer 36 mounted on the chuck. The chuck comprises the pins 30 and the annual sealing ring or flange 32. The surface layer 34 of the block is oxydised while the base is not to allow electrical contact to be made therewith.