| 发明名称 |
Brazing alloy. |
| 摘要 |
<p>A brazing alloy containing gold, indium and tin is disclosed which does not have the brittleness that is characteristic for gold/indium alloys. The brazing alloy contains about 60 to 80 weight % gold, about 15 to 30 weight indium and about 5 to 10 weight % tin. The alloy is particularly suited for bonding input/output electrical connection pins and semiconductor chips to a substrate. </p> |
| 申请公布号 |
EP0134532(A1) |
申请公布日期 |
1985.03.20 |
| 申请号 |
EP19840109084 |
申请日期 |
1984.08.01 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KOOPMAN, GEORGE NICHOLAS;MARCOTTE, VINCENT CHARLES |
| 分类号 |
C22C5/02;B23K35/26;B23K35/30;(IPC1-7):B23K35/30;H01L21/48;H01L21/50 |
主分类号 |
C22C5/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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