发明名称 METHOD AND DEVICE FOR AUTOMATIC SOLDERING
摘要 PURPOSE:To decrease electric power consumption and to economize energy by utilizing the waste heat of a solder tank in an automatic soldering device for a device for preheating a printed circuit board. CONSTITUTION:Toothed rotating members 5, 6, driven by a motor are rotated in an arrow A direction and a printed circuit board 75 mounted with electronic parts 78 is placed on a carrier 4 in an upper traveling section 9. When the carrier 4 arrives at the position right above a flux coater 70, the carrier descends and the flux is coated on the circuit board 75. After the board 75 is preheated in a preheating device 71, the board 75 is transferred by a lifting device to a lower traveling section 10. The carrier 4 descends upon arriving at the position right above a solder tank 72 to dip the board 75 into the tank 72 thereby soldering the circuit board. The waste heat of the molten solder in the tank 72 ascends and is used for preheating the device 71 in this stage. The circuit board 75 is cooled by a cooler 73. The cold wind thereof ascends and forms an air curtain 76 between the coater 70 and the device 71.
申请公布号 JPS6049860(A) 申请公布日期 1985.03.19
申请号 JP19830159337 申请日期 1983.08.31
申请人 ASAHI KAGAKU KENKYUSHO:KK 发明人 KABE ATSUSHI
分类号 B23K1/08;H05K3/34;(IPC1-7):B23K1/08 主分类号 B23K1/08
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