| 摘要 |
PURPOSE:To form Pd or Cu on the surface of an insulating material to activate by using a complex compd. obtained by allowing a compd. of bivalent Pd or a compd. of mono- or bivalent Cu to react with a reaction product of glucose and ammonia. CONSTITUTION:>=0.1mol concd. aq. ammonia is added to 1mol glucose, and the mixture is heated at 30-90 deg.C and stirred until an odor of ammonia is vanished. 0.24g obtained reaction product is added to 1g methanol and shaken, and 0.1g compd. among chloride, fluoride, bromide, iodide, oxide, and nitrate of bivalent Pd or a compd. among chloride, sulfate, etc. of mono- or bivalent copper is added. An insulating material to be electroless-plated with copper is immersed in an aq. soln. of said obtained complex compd., and heated at 30-100 deg.C to deposit the Pd and the Cu on the surface of the insulating material. The electroless copper plating is activated in this way. |
