发明名称 METHOD FOR PLATING AMORPHOUS ALLOY
摘要 PURPOSE:To obtain metallic plating having superior adhesion by completely removing a passivated film from an amorphous alloy as a base without corroding the alloy. CONSTITUTION:An amorphous alloy is chemically polished with an acidic activating bath prepd. by blending 15-25vol% hydrochloric acid (35% soln.) with 5-15vol% sulfuric acid (85% soln.), 5-15wt% citric acid, 0.5-1.5vol% acetic acid (90% soln.), 4-6vol% nitric acid (68% soln.), 0.1-0.3wt% nonionic or amphoteric surfactant and 0.05-0.15wt% amine-base corrosion inhibitor. The alloy is then activated with a cathodic electrolytic bath prepd. by blending 5-15vol% phosphoric acid (85% soln.) with 5-15vol% sulfuric acid (85% soln.), 5-15wt% citric acid, 0.5-1.5vol% acetic acid (90% soln.), 0.1-0.3wt% nonionic or amphoteric surfactant and 0.05-0.15wt% amine-base corrosion inhibitor. The activated alloy is plated with a metal.
申请公布号 JPS61253384(A) 申请公布日期 1986.11.11
申请号 JP19850000122 申请日期 1985.01.07
申请人 KOBAYASHI MASAMI 发明人 KOBAYASHI MASAMI
分类号 C23C30/00;C23G1/02;C25D5/24;C25D5/34;C25D7/00;C25F1/06 主分类号 C23C30/00
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