| 摘要 |
PURPOSE:To constitute a circuit compactly, and to reduce electrical impedance in the vicinity of a terminal resistor required for a driving circuit for a semiconductor integrated circuit element by forming the terminal resistor to a section extremely near to a chip as the element. CONSTITUTION:Resistors 8 are formed to the side surface of a ceramic substrate 1 through a thick film method. One end sections of the resistors 8 are connected to a bonding pad 3, and the other end sections are connected to a common terminal 9. Consequently, the resistors 8 are connected in parallel with each signal terminal in a semiconductor integrated circuit element, and connected to a ground or a power supply by the terminal 9. Accordingly, the resistors 8 are used as terminal resistors. |
