| 摘要 |
PURPOSE:To attract a semiconductor wafer securely for transportation preventing any split or crack from happening by a method wherein a bump or stopper is provided inside a cone cup of a wafer chuck. CONSTITUTION:A hole is opened at the top of an attracting cup 12 as a wafer chuck to insert a boss 11 holding the cup 12 while a nozzle 13 is threaded into the boss 11 from the inside of the cup 12 to be fixed. The inside of the boss 11 and the nozzle 13 is provided with a duct line passing gas while the outlet of the gas of the nozzle 13 is provided almost in the horizontal omnidirection so as to discharge the gas along the inner wall surface of the cup 12. Stoppers 14 may be provided on the positions along the inside periphery of the attracting cup 12 whereon the edges of a semiconductor wafer 15 hit. |
