发明名称 THE FABRICATION METHOD OF SEMICONDUCTOR
摘要 The desired part of the substrate surface of a single crystalline semiconductor is covered with an insulating layer. The part of the exposed surface of the single crystalling semiconductor and the desired part of the insulating layer are covered with a polycrystalline semiconductor layer of amorphous semiconductor layer. By irradiating the laser, the desired part of the polycrystalline semiconductor layer or amorphous semiconductor layer are formed into a single crystal. The PN junction is formed on the single crystalline semiconductor layer.
申请公布号 KR850000277(B1) 申请公布日期 1985.03.15
申请号 KR19800004459 申请日期 1980.11.21
申请人 HITACHI LTD. 发明人 DAMURA, MASAO;WADA, YASUO;DAMURA, HIROSHI;KOSUGA, HIROGUJI;OGURA, MAGODO;TOGUYAMA, DAGASHI
分类号 H01L21/20;(IPC1-7):H01L21/20 主分类号 H01L21/20
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