| 摘要 |
PURPOSE:To prevent the peeling defect of a bonding wire, by covering a semiconductor element by means of a cap which is entirely coated with epoxyresin, conducting a vacuum-deareating operation, thereafter curing said resin to seal the cap. CONSTITUTION:Epoxyresin 31 is spread only on a part of the sealing surface of a cap 30 made of Kovar metal, and a semiconductor element 15 is covered from the above with the cap 30, which is temporarily fastened onto a glass substrate. In such condition, the cap 30 is heated in air and fixed onto the glass substrate in semi-cured condition. Next, the cap 30 is almost completely covered with liquid epoxyresin 32 and is put into a vacuum apparatus, and vacuum deareating operation is carried out under a reduced pressure in order to exhaust the air contained in the resin and the cap 30, thereafter complete curing of the epoxyresin is conducted by heating. This operation can be performed at a comparatively low temperature, does not cause characteristic deterioration inside the display tube containing an already-produced anode display part and does not cause peeling-off defect of the bonding wire. |
