Mounting integrated circuit devices

摘要

A method of mounting and interconnecting electronic integrated circuits 4 comprises the steps of preparing a substrate 10 of substantially insulating semiconductor material eg Si, forming metallised interconnection conductor patterns 11 on said substrate, said patterns having surface connection areas 11b, attaching one or more electronic integrated circuits 4 to the substrate whereby the circuits make electrical contacts with certain of said connection areas, mounting the semiconductor substrate on a printed circuit structure or carrier 12 and forming electrical connections between other surface connection areas 11b and the printed circuit or carrier.