| 摘要 |
PURPOSE:To obtain a resin-sealed semiconductor device having high reliability without deteriorating moisture resistance due to solder dipping by burying leads of supporting a tab for placing a semiconductor element in sealing resin. CONSTITUTION:Leads 2b of supporting a tab 1b for placing a semiconductor element 3b are connected fixedly to inner leads 5b via a supporting member 12b through an organic adhesive 11b. The leads 2b are previously cut to fall within the sealing range of molding resin 7b. Thus, even if abrupt thermal stress such as solder dipping is applied, impurities from the exterior and main invading route of moisture are interrupted. Therefore, the moisture resistance is not deteriorated. |
