| 摘要 |
<p>PURPOSE:To improve the characteristic of heat dissipation without providing a heat dissipating plate by a method wherein the surface is provided with a plurality of grooves. CONSTITUTION:Inner leads 3, an die-attachment 4, a chip 5, and Au wires 6 are contained in the package body 1. The bottom 8 of the groove 7 provided in the package body 1 is made thinner than the package dimension (a). Since the effective surface area of the package body 1 increases by the presence of this groove 7, the characteristic of heat dissipation improves without providing a heat dissipating plate and the like.</p> |
