发明名称 CORRECTION OF HEIGHT AT LSI MANUFACTURING DEVICE
摘要 PURPOSE:To check erroneous motion in regard to correction of the height direction at manufacture of LSI by a method wherein correction is not performed in the range when the variation of the height direction of the top surface of a sample offers no problem, a convergent beam for correction of height is radiated to a region having no level difference of a pattern, and correction of the height direction is performed to every chip basing on the height direction variation quantity detected at this time. CONSTITUTION:A beam emitted from a luminous part 6 is converged to be radiated onto a sample 2 through a mirror 13a, the beam reflected from the sample 2 is imaged on a light receiving part 7 through a mirror 13b, and the variation of the height direction of the sample 2 is detected according to a height variation detecting part 8. A synchronous signal is sent out to the height variation detecting part 8 from a computer 3 when the scanning position of the electron beam comes to a boundary region 22ab between a chip part 21a and a chip part 21b, and correcting deflection quantities to respective deflection quantities at the next chip part 21b are calculated basing on the detected variation quantity at this position. Then the calculated deflection quantities thereof are sent out to a deflection control part 9, and scanning is performed using the detected correcting deflection control quantity when drawing in the chip 21b is to be performed.
申请公布号 JPS6045022(A) 申请公布日期 1985.03.11
申请号 JP19830153773 申请日期 1983.08.23
申请人 TOSHIBA KK 发明人 IKENAGA OSAMU
分类号 H01L21/027;G03F7/20;G03F7/207;H01J37/147;H01L21/30;H01L21/66;H01L21/67;H01L21/68 主分类号 H01L21/027
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