| 摘要 |
PURPOSE:To enable the sufficient absorption of mechanical shocks or stresses at the time of thermocompression bonding by a method wherein an aluminum layer is provided between the fixed region of an aluminum wiring and a bump electrode for tape automatic bonding. CONSTITUTION:The insulation film 2 of the bonding region on a semiconductor substrate 1 is opened by the photoetching method, and then the Al 3 of the bonding region is exposed. Next, Al 3' is adhered over the entire surface by he vacuum vapor deposition or sputtering method. Here, the Al 3' plays a role of an electrode at the time of Au plating performed in a later process, finally remains as part of the bump structure, and becomes the absorption layer of mechanical shocks or stresses impressed at the time of thermocompression bonding. It is preferable that the film layer is thick. The formation and removal of a photo resist 7, an adhesion metallic layer 4, the adhesion of a barrier metallic layer 5, and the formation of the bump 8 are passed through, and finally the unnecessary Al 3' other than in the bump is etched with the metal 4 as a mask. |
