| 摘要 |
PURPOSE:To eliminate a necessity of combination of a heat radiating plate and lead parts and to contrive to reduce the manhour and the direct material cost by a method wherein the heat radiating plate part of the lead frame is bent and after the heat radiating plate part was made to inversely position to the lead parts, a semiconductor chip is installed. CONSTITUTION:A plural number of lead parts 1 have been mutually coupled by coupling bodies 3 and 4 and the lead parts 1 have been connected with both side frames 2 by the coupling bodies 3 and 4 as well. A heat radiating plate part 5 has been coupled to both of the side frames 2 by a coupling body 6, adjoining to the lead parts 1. The heat radiating plate part 5 is bent in the directions of arrows A and B and is brought to a position 51 indicated by dotted lines. Then, a semiconductor chip 7 is die-bonded with the face of the bent heat radiating plate 5 on the side of the lead parts, an electrode on the upper face thereof and the lead part 1 are mutually connected by bonding of wires 8, the lower face of the heat radiating plate 5 and the end part of the lead part 1 are made to expose, a molding is performed with a resin 9, and each coupling body 3, 4 and 6 are separated, thereby enabling to complete a semiconductor device. |
