发明名称 ASSEMBLING STRUCTURE OF ELECTRONIC CIRCUIT PACKAGE
摘要 <p>PURPOSE:To enable to absorb dispersion of the height of an element, to obtain stable contact of the element and a cooling plate, and to make heat radiation of the high- power element possible by a method wherein the element to be cooled is pushed against the cooling plate by a cam and a plate spring. CONSTITUTION:Before a shaft 41 is rotated, the long axis of a cam 44 is in a horizontal state. For that, the input and output pins 34 of a circuit element have been deeply inserted in a socket 20 and an interval G has been formed between the upper face of a case 31 and the lower face of a cooling plate 50. Here, when the shaft 41 is turned at 90 deg. clockwise, the long axis of the 44 is brought into a vertical condition, the circuit element is pushed up, and the upper face of the case 31 is made to tightly contact to the lower face of the cooling plate 50 by the force of a plate spring 36. The input and output pins 34 have been made the lengths thereof longer so as to be able to keep maintaining favorably an electrical connection with the contactors 22 of the socket 20 even though the circuit element is made to shift upwards. Dispersion of the external shape of the circuit element, warpage and distortion of a printed substrate 10, rising and inclination of the element to the printed substrate 10, etc., can be absorbed by the plate spring 36, thereby enabling to realize uniformly and stably the contact of the cooling plate 50 and the element.</p>
申请公布号 JPS6043848(A) 申请公布日期 1985.03.08
申请号 JP19830151435 申请日期 1983.08.19
申请人 NIPPON DENKI KK 发明人 MATSUO YOUICHI
分类号 H01L23/36;H01L23/40 主分类号 H01L23/36
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