发明名称 |
DEVICE FOR CUTTING AND BENDING LEAD WIRES |
摘要 |
A device for cutting lead wires of an electronic circuit element mounted on a printed circuit board into a desired length and for bending the lead wires to be close to the bottom surface of the printed circuit board is capable of dealing with an electronic circuit element having three lead wires as well as that having two lead wires. The device comprises a fixed block having a stationary blade which has two side holes and a central hole formed therethrough, a pair of side levers having laterally movable blade members which are slidable on the surface of the stationary blade to cut and bend lead wires inserted through the side holes of the stationary blade, and a central lever having a movable blade member which are slidable on the surface of the statonary blade to cut and bend a lead wire inserted through the central hole of the stationary blade. |
申请公布号 |
GB2144362(A) |
申请公布日期 |
1985.03.06 |
申请号 |
GB19840017528 |
申请日期 |
1984.07.10 |
申请人 |
* TDK CORPORATION |
发明人 |
HIROSHI * YAGI;YOSHIO * HARADA;TETSURO * ITO |
分类号 |
B21F11/00;B23D31/00;H05K13/04;(IPC1-7):B23D15/10 |
主分类号 |
B21F11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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