发明名称 |
Elements and devices for assembly of electronic components. |
摘要 |
<p>A chip carrier mounting device includes a retaining member having a predefined pattern of apertures in which are positioned preforms of joint-forming matenal such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. The joint-forming material may be filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.</p> |
申请公布号 |
EP0133752(A2) |
申请公布日期 |
1985.03.06 |
申请号 |
EP19840304532 |
申请日期 |
1984.07.02 |
申请人 |
RAYCHEM CORPORATION (A DELAWARE CORPORATION) |
发明人 |
ALLEN, LESLIE JOHN;CHERIAN, GABE;DIAZ, STEPHEN H. |
分类号 |
B23K3/06;B23K35/02;H05K3/32;H05K3/34;H05K3/40;H05K13/04;(IPC1-7):B23K3/00 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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