Encapsulated hot spot fuse link

摘要

There is disclosed an encapsulated fuse link whereby a lower melting point metal such as tin is deposited between two reduced cross sectional areas of a higher melting point base material such as copper or silver which forms the major surface area of the link. The area upon which the lower melting point metal is deposited is encapsulated by means of nonconductive material such as a high temperature plastic tube which is secured to the major surface of the link by some means such as staples at either end. The structure prevents the low melting point metal from migrating or traveling down the fuse link during operation which would undesirably tend to alter the characteristics of the fuse.