摘要 |
A low temperature curing coating composition containing 10-80% by weight of binder and 20-90% by weight of an organic solvent in which the binder is (1) an acrylic polymer containing monomers having reactive groups such as acrylamide, methacrylamide, methacrylic acid, acrylic acid and glycidyl methacrylate, (2) an epoxy resin, (3) a polyamine curing agent, (4) phenol and (5) a bicyclic amindine; The composition is used as a primer or topcoating for metal substrates and curings at temperatures of 0 DEG C. to ambient temperatures and provides a primer that has excellent adhesion to the substrate and provides a durable, corrosion resistant finish.
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