| 摘要 |
PURPOSE:To reduce the rate of improper bonding by forming in advance a gold seat by a ball bond at a stitch bond side, ball bonding on an electronic part, and then stitch bonding on the seat. CONSTITUTION:I/C pellets 4, 5 are mounted on a circuit board 9 on which a conductive pattern 2 and a resistor 3 are formed by printing on an insulating substrate 9. Then, gold seats 6, 6' are formed in advance by ball bond at the stitch bonding positions of a pattern 2 and a pellet 4. Then, a stitch bond 8 is formed on the seat 6 formed on the ball bond 7 and the pattern 3 on the pellet 5. Thereafter, a ball bond 7 is formed on the pellet 5, and a stitch bond 8' is formed on the seat 6' formed with the pellet 4. |
