SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE:To reduce the number of resistors and to reduce the bonding capacity of the resistors by preparing an external connecting current switching type logic circuit which reduces in the resistance value at the peripheral edges of current switching type logic circuit group. CONSTITUTION:A current switching type logic circuit 4 in which current switching type logic circuits are arranged in a matrix shape is formed at the center of a chip 1. Internal exclusive current switching type logic circuits 4b are formed at the interior and external connecting current switching logic circuits 4a are formed at the outer periphery. An output emitter follower transistor 3 is fored around the chip 1. A pad 2 for connecting to other chip is provided at the outside of the transistor 3. When the logic circuit 4b delivers a signal to the exterior, the logic circuit 4a is wired to become the final stage, thereby delivering the signal to exterior through the transistor 3.