发明名称 WIRE BONDING OF ELECTRONIC COMPONENT PARTS
摘要 PURPOSE:To enable to perform wire bonding of a gold wire piece surely at a correct position always by a method wherein the gold wire piece bonded in the vertical pose is bent toward another lead piece due to the jetting of gas from a nozzle. CONSTITUTION:A gold wire piece 5 completed with a first bonding process, and bonded to a cathode lead piece 2 is transferred to the position of the next second bonding process in the condition standing vertically as it is. At the position of the second bonding process, gas is jetted from a nozzle 14 before descending motion of a pressing piece 13 is started. The gold wire piece 5 is bent to the direction of an anode lead piece 3, and a ball 11 at the tip thereof comes in contact with the anode lead piece 3. Jetting of gas is stopped at the point in time when bending thereof is completed, the pressing piece 13 is operated downward, and the ball 11 is pressed to the anode lead piece 3 to be bonded. By setting correctly the jetting direction of gas from the nozzle 14, the ball 11 at the tip can be positioned correctly at the prescribed position of the anode lead piece 3, and bonding can be attained at the correct position.
申请公布号 JPS6039839(A) 申请公布日期 1985.03.01
申请号 JP19830148672 申请日期 1983.08.12
申请人 ROOMU KK 发明人 KAMIYAMA SUSUMU
分类号 H01L21/60 主分类号 H01L21/60
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