| 摘要 |
PURPOSE:To enable to manufacture with high efficiency and moreover at low cost a semiconductor device constructed by separate type lead frames by a method wherein communicating runner parts to communicate mutually with adjoining cavities are provided to a metal mold. CONSTITUTION:Communicating runner parts 11-13 to communicate mutually with cavities are formed between the adjoining cavities of the cavities 8-10. The communicating runner pats 11-13 thereof are the recesses to form connecting parts manufactured of resin to connect adjoining heat sinks at the edge faces thereof. The connecting parts 15, 16 manufactured of resin to connect the fellow edge faces of the heat sinks according respectively to the communicating runner parts 12, 13 are formed between the adjoining heat sinks 3A, 3B and between the adjoining heat sinks 3B, 3C of molded parts manufactured by separate type lead frames 1 using the metal mold thereof. The connecting parts 14-16 thereof are cut off to be removed together with the unnecessary parts of the lead frames at the next lead cut process, and the resin sealed semiconductor devices of three pieces can be obtained. |
