| 摘要 |
The semiconductor component comprises a tray of semi-conductive material in the form of a multiply cornered structure with a centrally arranged active area. There are contact bodies on either side of the tray which are in electrical and thermic contact with the opposing surfaces of the tray. A casing of electrically insulating material encloses the contact bodies and the tray. - The tray is provided with mechanically weakened parts between the active area and at least some of the tray corners, such parts being formed by incisions into the tray. The tray has less thickness in the weakened parts than in remaining areas. |
