| 摘要 |
PURPOSE:To facilitate mounting and demounting while reducing cost by obliquely installing a heat sink to a chassis, horizontally mounting a substrate aslant soldered to a power pack to the chassis and screwing the power pack to the heat sink. CONSTITUTION:A heat sink 1 is placed on a pair of brackets 5B inclining to the bottom 5A of a chassis 5. Screws 5D are inserted to the brackets 5B and the heat sink 1 from an opening section 5C bored to the bottom 5A. A substrate 2 is soldered obliquely to power packs 3 by utilizing a solder tank, and fitted horizontally to the bottom 5A of the chassis 5 by screws. The power packs 3 are mounted to the heat sink 1 by screws 4. |
