摘要 |
PURPOSE:To obtain a high output and to improve the frequency characteristics at a high band by using >=1 layer (less than 10mum thickness) of a soft magnetic metallic film having small specific resistance to form a head core chip part via an insulated film. CONSTITUTION:Core halves 9 and 10 are formed by holding a soft magnetic film 5 made of >=1 layer of ''Sendust'' film between a pair of nonmagnetic substrates 4 and 4'. The faces of halves 9 and 10 where films 5 are formed are butted to each other via a nonmagnetic film 8 and then bonded together to form a gap. At the same time, a winding window 11 is formed to either a half 9 of 10. |