| 摘要 |
PURPOSE:To prevent the generation of displacement on a positioning by forming irregularities, positions thereof are prescribed fitted to joining surfaces for upper and lower ceramic members, in a glass sealing ceramic package consisting of the ceramic members as a cap and a base. CONSTITUTION:A recessed section 6 for receiving a semiconductor element is formed at the central section of a base 1 consisting of a ceramic member, an upper surface as a joining surface is coated with a low melting-point glass layer 4, and leads 3 are fitted on the layer 4 under the state of a lead frame. A lower surface as a joining surface for a cap 2 composed of a ceramic member is coated with a low melting-point glass layer 4. Projecting sections 9 for positioning having a shape corresponding to recessed sections 8 for positioning having a specific shape bored at end sections on the base 1 side are formed at end sections on the cap 2 side. The cap 2 is superposed on the base 1, and the triangular projecting sections 9 are fitted to the triangular recessed sections 8. Accordingly, the mutual positions of the upper and lower ceramic members are prescribed, and displacement on a bonding is removed when the low melting-point glass layers 4 are melted as they are and a section between the ceramic members is hermetically sealed. |
