POLY AMIDE COMPOSITION

摘要

A heat-resistant polyamide compsn. with improved adhesivity to rubbers is prepd. by adding 0.0001-0.1 wt.% copper compd., 0.0003- 0.15 wt.% inorganic halogen compd., and 0.0002-0.3 wt.% condensed polymer of diphenyl amine and acetone (or a mixt. of diaryl ketone and N,N'-diphenyl-para-phenylene) to the polyamide. All weight percentages are based on the weight of the polyamide.