发明名称 MOLDING APPARATUS FOR THERMOSETTING RESIN
摘要 PURPOSE:To adjust a die temperature to an optimal level instantaneously by detecting a transfer displacement in a movable die and controlling a die temperature with a heating and cooling controller after comparing gelation timing and curing timing with a standard value with an arithmetic apparatus. CONSTITUTION:Displacement of movable die 5 is sensed by a detector 9a and then is processed by a displacement meter 9b. After this process, gelation timing GT and curing timing CT obtained by twice differenting the processed data with an arithmetic apparatus are compared with standard gelation time and curing time. If GT and CT are less than the standard time, a signal e to reduce temperature in the die 3, 5 is output to a heating and cooling controller 14. If GT and CT are greater than the standard time, a signal f, to raise the temperature in the die 3, 5 is output to the heating and cooling controller 14. Thus the temperature of the die 3, 5 is adjusted to an optimal heating level.
申请公布号 JPS6038118(A) 申请公布日期 1985.02.27
申请号 JP19830147683 申请日期 1983.08.11
申请人 INA SEITOU KK 发明人 YOGOU TOMOAKI
分类号 B29C33/02;B29C33/38;B29C43/02;B29C43/52;B29C43/58;B29K101/10 主分类号 B29C33/02
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