| 摘要 |
PURPOSE:To monitor immediately and continuously, a molding process for thermosetting resin by detecting thermal expansion during gelation and contraction during curing of thermosetting resin, said detection being effected by monitoring the displacement of a movable die. CONSTITUTION:The degree of displacement of a movable die 5 to a fixed die 3 is detected by a detector 9a of a displacement sensor 9 and then is processed by a displacement meter 9b. After this process, the processed data is differentiated twice by an arithmetic apparatus 11 to obtain gelation timing GT and curing timing CT based on the outflow stopping time a., curing starting time b. and curing ending time c. of thermosetting resin 8. The arithmetic apparatus 11, in comparison with a standard gelation timing and curing timing, outputs signals e,f for temperature rise or drop to a heating and cooling controller 14 in an appropriate manner. |
