| 摘要 |
A circuit arrangement comprises an integrated semiconductor circuit in a casing with a plurality of connection leads A, B, C, in which stray capacitances with equal temperature coefficients exist between one connection lead and the two adjacent, second and third, connection leads and in which a voltage UBA is present between the first and second connection leads, which effect of this temperature-dependent current, a compensation voltage UCB is applied between the first and second connection leads, which compensation voltage causes a current UCB which is equal and opposite to the current IBA through the stray capacitance between the first and second connection leads to flow through the stray capacitance between the first and third connection leads. |
