| 摘要 |
<p>PURPOSE:To obtain a resin sealed type semiconductor device, which can perform highly reliable operation, even at a high temperature and high humidity, by sealing the semiconductor with a resin composition including a multifunctional epoxy compound. CONSTITUTION:In a resin composition, which seals this resin sealing type semiconductor device, a multifunctional epoxy compound expressed by a general formula I ((m) represents the numbers of zero, 1 or 2) and the following materials are used together. Namely, a novolak type phenol resin, poly-p- hydroxystyrene, glycerol tris trimellitate expressed by a general formula II, a mixture of a trimer and a tetramer of phenoxyphosphagen expressed by a general formula III (R represents hydrogen or bromine), fulorocarbon polymer including nitrogen, isocyanate compound having an uretedione ring, maleimide compound, a hardening agent, and a material including at least one kind of component, which is selected out of a group comprising a rubber component having a functional group that can react with an epoxy group. Therefore, the resin composition has excellent moisture resistance and heat resistance. Thus intrusion of water is prevented.</p> |
