| 摘要 |
PURPOSE:To omit bump processing on a semiconductor element, when the semiconductor element is bonded, by fixing the semiconductor element a die bonding part, and connecting the semiconductor element and leads with wires. CONSTITUTION:On the surface of a long piece of resin film 1, die bonding parts 2 and leads 3 are provided. Resin films 4 fixed to the film by bonding or molding. A part 3a of each lead, to which a wire is connected, and each die bonding part 2 are surrouned by each frame 4. A semiconductor element 6 is mounted on the die bonding part 2, on which conducting paste 5 is applied. The paste 5 is heated, hardened and fixed to the die bonding part 2. The semiconductor element 6 and the lead 3 are connected with wires 7. A sealing resin 8 is injected in the frame 4 and hardened. The film is cut into single bodies by blanking, and the semiconductor package are completed. |
