| 摘要 |
PURPOSE:To improve the characteristics of electroless copper plating by immersing an article to be plated in an aqueous soln. contg. a complex compound prepd. by reacting a bivalent Pd compound or a uni- or bivalent Cu compound with aminosaccharide, pulling up the article, and heating it to produce metallic Pd or Cu. CONSTITUTION:An article to be plated is immersed in an aqueous soln. of a complex coumpound prepd. by reacting a bivalent Pd compound or a uni- or bivalent Cu compound with aminosaccharide. The concn. of the complex compound in the aqueous soln. is <=1wt% when the compound is expressed in terms of Pd or Cu. The article is pulled up from the soln., and it is heated to 30- 200 deg.C to form metallic Pd or Cu particles on the surface of the article. The article is then subjected to electroless copper plating by a conventional method. |
