| 摘要 |
PURPOSE:To improve the characteristics of the resulting electroless copper plating by adding a complex compound which is prepd. by reacting a bivalent palladium compound or a uni- or bivalent copper compound with glucose and produces metallic Pd or Cu by heating. CONSTITUTION:To a catalyst for electroless copper plating is added a complex compound which is prepd. by reacting a bivalent palladium compound or a uni- or bivalent copper compound with glucose and produces metallic Pd or Cu by heating. The amount of the complex compound added is <=1wt% when the compound is expressed in terms of Pd or Cu. Palladium (II) chloride, palladium (II) fluoride, plladium (II) bromide, palladium (II) iodide or the like is used as the bivalent palladium compound. Copper ( I ) chloride, copper (II) chloride, copper (II) sulfate or a mixture thereof is used as the uni- or bivalent copper compound. |
