| 摘要 |
PURPOSE:To facilitate assembly and environmental tests by a method wherein, when a plurality of rectangular chips with different chip sizes are formed on one semiconductor substrate, a plurality of the chips of one type and a plurality of the chips of another type are formed separately with a scribing line at their boundary in such a manner that the two types of chips touch with each other at their corners and vacant regions formed by above method are removed. CONSTITUTION:When chips of LSI-A and chips of LSI-B, which have chip sizes different from each other, are formed on the same semiconductor substrate, at first LSI-A chips are formed above a scribing line, which is used as a boundary, using one type of mask. Then LSI-B chips are formed below the scribing line so as to make corners of LSI-B chips touch the corners of LSI-A chip using another type of mask. Thus, the formation of these LSI chips is made easier. With this method, vacant regions 2 are formed above the scribing line and between LSI-A chips and vacant regions 3 are formed below the scribing line and between LSI- B chips, but these regions are unnecessary parts and cut off at the time of scribing. |
