| 摘要 |
PURPOSE:To enable to attain sure measurement of a semiconductor element without applying damage to the element by a method wherein the semiconductor element intending to perform measurement is slipped in up-and-down shoots built in with a heater, the element is stopped when it reaches the central part of the shoots, and measurement is performed. CONSTITUTION:An element 1 intending to perform measurement is slipped in a pit between inclined up-and-down shoots 5, 4 built in with a heater, and the element 1 is stopped when it reaches a measuring part consisting of a first and a second guides constructing the shoots. Namely, the projecting parts 3 of leads 2 projecting from the element 1 are pressed down by stoppers 8, the element 1 is pinched by guides 6, 7 to press down the leands 2 by a gate type lead press 13, and the element 1 is fixed at first according to a spring 14 provided inside of the press 13. Then the stoppers 8 are removed to expose the edge parts of the leads 2, the press 13 is descended moreover, the projecting parts 3 are pinched by the press 13 and contacts 9 surrounding the element 1, and the prescribed measurement is performed. After then, the element 1 is made to be in a free condition, and discharged from the other edges of the shoots 4, 5. |
