发明名称 ELECTROLESS PLATING METHOD
摘要 PURPOSE:To form a good electroless plating film on the surface of a non-conductor, by using a metal salt including a nickel or cobalt salt, an ammonium salt and acetate, and a reducing agent containing borohidride, ammonia and acetate. CONSTITUTION:An aqueous solution containing about 0.05-0.2mol/l of a nickel salt, about 0.2-0.5mol/l of an ammonium salt and about 0.1-0.5mol/l of acetate and a reducing liquid comprising an aqueous solution containing about 0.01- 0.05mol/l of borohydride, about 5-30ml/l of aqueous ammonia and about 0.1- 0.5mol/l of acetate are simultaneously sprayed from separate nozzles to form an electroless nickel plating film, which has a thickness withstanding electrocasting, has excellent surface property free from surface defects such as a pinhole or crack and good close adhesiveness, to the surface of a non-conductor.
申请公布号 JPS6033356(A) 申请公布日期 1985.02.20
申请号 JP19830139888 申请日期 1983.07.30
申请人 NIPPON VICTOR KK 发明人 MARUYAMA HIDEO
分类号 C23C18/32;C23C18/34 主分类号 C23C18/32
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