发明名称 MATERIAL OF MASK FOR DRY ETCHING
摘要 PURPOSE:To enhance dry etching speed and producibility of a mask by forming a thin film substantially made of at least one of W, Ta, and Ti on a support. CONSTITUTION:A thin film made of at least one of W, Ta, and Ti having 50- 500nm thickness and a ratio of optical density to film thickness of about 3/ 100nm at 436nm wavelength is formed on a support, such as soda glass plate, to form a mask material used for dry etching. Nitrogen and oxygen may be contained in said thin film in an amt. of <=about 50atom% and <=30atom%, respectively.
申请公布号 JPS6033555(A) 申请公布日期 1985.02.20
申请号 JP19830142672 申请日期 1983.08.04
申请人 KONISHIROKU SHASHIN KOGYO KK 发明人 HATANO TAKASHI;KATOU TAKAYUKI;OKASATO MAYUMI
分类号 H01L21/302;G03F1/00;G03F1/54;G03F1/68;G03F1/80;G03F1/88;H01L21/027;H01L21/3065 主分类号 H01L21/302
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