| 摘要 |
PURPOSE:To improve the electrical and thermal conduction by soldering the bottom of a package to the heat sink plate of a printed circuit board side directly without heat sink of the package. CONSTITUTION:When a flat package 12 is mounted on a ceramic circuit board 9, a solder connection unit 14 metallized and Au-plated so as not to shortcircuit to the lead mount 13 of the bottom of the package 12 is provided. A solder connection unit 15 metallized and Au-plated to the opposed ceramic circuit board is provided. For example, low melting point solder is preliminarily soldered to the leads 10 and the solder connection unit 14, a ceramic circuit board 9 is placed on the heater block, the package 12 is then placed, the both solder connection units 14, 15 are bonded to be scrubbed to moisten to each other, the connection unit of the pattern and the leads of the package are positioned, pressed from above and bonded. |
